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2. 25 SMT/PCB & NEPCON Korea 2004 ±â¼ú¼¼¹Ì³ª °³ÃÖ
9. 2~3 ISMP 2004 °³ÃÖ
2003 4. 9. SMT/PCB & NEPCON Korea 2003 ±â¼ú¼¼¹Ì³ª °³ÃÖ
9. 24~25 ISMP 2003 °³ÃÖ
11. 14 2003³âµµ Á¤±âÃÑȸ ¹× Ãß°è ±â¼ú½ÉÆ÷Áö¿ò °³ÃÖ
2002 11. 8 2002³âµµ Á¤±âÃÑȸ ¹× Ãß°è ±â¼ú½ÉÆ÷Áö¿ò °³ÃÖ
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3. 20 ±¹Á¦Ç¥¸é½ÇÀå ¹× Àμâȸ·Î±âÆÇ »ý»ê±âÀÚÀçÀü SMT/PCB ±â¼ú¼¼¹Ì³ª °³ÃÖ
2001 12 Çѱ¹ÇмúÁøÈïÀç´Ü¿¡ '¸¶ÀÌÅ©·ÎÀüÀÚ ¹× ÆÐŰ¡ÇÐȸÁö' Èĺ¸ÁöÇÐȸÁö µîÀç
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4. 25 Á¦6ȸ ±¹Á¦½ÉÆ÷Áö¿ò °³ÃÖ
2000 11. 3 2000³âµµ Á¤±âÃÑȸ ¹× Ãß°è ±â¼ú½ÉÆ÷Áö¿ò °³ÃÖ
10. 26 Á¦2ȸ ÇÑÀÏ ¹ÝµµÃ¼ ÆÐŰ¡ ±â¼ú¼¼¹Ì³ª °³ÃÖ
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4. 24 Á¦5ȸ ±¹Á¦½ÉÆ÷Áö¿ò °³ÃÖ
1999 12. 15 Á¦1ȸ ÇÑÀÏ ¹ÝµµÃ¼ ÆÐŰ¡ ±â¼ú¼¼¹Ì³ª °³ÃÖ
11. 12 1999³âµµ Á¤±âÃÑȸÃß°è ±â¼ú½ÉÆ÷Áö¿ò °³ÃÖ
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2. 15 Çѱ¹Çмú´Üü¿¬ÇÕȸ ÇÐȸÃѶ÷¿¡ µîÀç
1998 11. 14 1998³âµµ Ãß°è ±â¼ú½ÉÆ÷Áö¿ò °³ÃÖ
4. 20 Á¦4ȸ ±¹Á¦¼¼¹Ì³ª °³ÃÖ
3. 14 Çѱ¹ ÇÏÀ̺긮µå ¸¶ÀÌÅ©·ÎÀÏ·ºÆ®·Î´Ð½º ÇÐȸ¿¡¼­ Çѱ¹ ¸¶ÀÌÅ©·ÎÀüÀÚ ¹× ÆÐŰ¡ ÇÐȸ·Î ÇÐȸ¸í º¯°æ
1997 11. 5 97 Á¦2Â÷ ±â¼ú½ÉÆ÷Áö¿ò °³ÃÖ
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1996 10. 29 Á¤±âÃÑȸ ¹× ¿¬±¸¹ßǥȸ °³ÃÖ
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1995 11. 2 Á¤±âÃÑȸ ¿¬±¸¹ßǥȸ ¹× Á¦2ȸ ±â¼ú½ÉÆ÷Áö¿ò °³ÃÖ
5. 18 1st ISHM-KOREA ½ÉÆ÷Áö¿ò °³ÃÖ
1994 11. 4 Á¤±âÃÑȸ ¹× ¿¬±¸¹ßǥȸ °³ÃÖ & Á¦3ȸ ISHM-KOREA ½ÉÆ÷Áö¿ò °³ÃÖ
11. 13~17 ISHM 94-Boston ½ÉÆ÷Áö¿ò ¹× Àü½Ãȸ °³ÃÖ
4. 26 Á¦2ȸ Hybrid Microelectronics and Multichip Packaging¼¼¹Ì³ª °³ÃÖ
1993 10. 15 ISHM-KOREA Á¤±âÃÑȸ ¹× ¿¬±¸¹ßǥȸ
7. 20 Á¦2ȸ ±â¼ú¼¼¹Ì³ª °³ÃÖ
4. 2 Á¦1ȸ ±â¼ú¼¼¹Ì³ª °³ÃÖ
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